M2M MULTIX++


产品线

MULTIX ++完全并行架构提供无与伦比的性能。 MULTIX ++系统是优化检测速度的理想选择,可以并行驱动多达256个通道。 可直接使用其专用软件或通过第三方应用程序远程使用。 可以使用设置软件处理复杂的配置。

下载

处理技术

 

标准相控阵

MultiX ++系统可以执行电子和/或扇形扫查,全矩阵捕获(FMC),脉冲回波,采用标准UT,TOFD,线性,矩阵,TRL,个性化2D ...相控阵探头进行间距捕获采集,最多可包含256个晶片

表面自适应超声波 (SAUL)

表面自适应超声波 (SAUL) 技术专为复杂复合材料结构的检测而设计,可使用独特的配置检测具有不同几何形状(平面,凹面,凸面)的元件。 SAUL是飞机制造商及其供应商使用的理想工具,用于检测复杂的复合材料部件。
了解更多

SAMRT

智能柔性探头是由CEA和IMASONIC共同设计的相控阵探头(线性或矩阵),具有适形的前面和实时轮廓。 SMART是M2M处理这些探头的软件插件。当探头沿着复杂的部件移动时,SMART能够实时保持超声波束的特性。

快速模式

快速模式本身包含在MultiX ++系统中,可优化多个孔径的并行点火(在相同或不同的探头上)。 它旨在提高生产率,同时保持与电子扫查所达到的相同分辨率。
此外,当接收阵列的整个光圈与电子扫描相结合时,快速模式甚至可以实现更快的速度。 此过程仅需单词发射的时间。 非常适合检测
厚元件又要求速度的情况。

了解更多

SPECIFICATIONS

 

acquisition
Hardware acquisition gates, software gates, synchronization of gates

Acquisition trigger on event (threshold, echo, etc.),
acquisition on user-specified trigger (e.g., time, coder)

Choice of data (e.g., RF, peaks, elementary A-Scan), real-time imaging, user-specified configuration

Public file format for parameters (XML) and data (binary), max. data flow 30 MB/s

phased-array
Customized focusing, electronic scanning, sectorial scanning,
full matrix capture (FMC)

Pulse-echo and transmit-receive modes, DDF with dynamic aperture

2GB hardware RAM (enabling fast multiplexing),

Corrected images (e.g., sectorial B-Scan, C-Scan)

pulsers
Adjustable voltage: 30 to 200V with 1V step

Negative rectangular pulse

Adjustable width: 30 ns to 625 ns, step of 2.5 ns

Rise time < 10 ns (200V, 50 Ω)

Max. PRF: 30 KHz

receivers
Bandwidth: 0.8 to 20MHz

Adjustable gain on each channel from 0 to 80 dB

Cross-talk between two channels > 50 dB

Max. input signal amplitude: 0.8 Vpp

Adjustable analog DAC on 80 dB (max. 40 dB/µs) synchronized on events

digitizer
Digitizing and real-time summation on 32-channel boards

Max. sampling frequency: 100 MHz (adjustable from 100 MHz to 6.6 MHz)

Global delay: 0 up to 1.6 ms, step of 10 ns

Delay-laws at transmission/reception: 0 to 20 µs, step of 2.5 ns

Range: 16 bits

FIR filters

Input impedance: 50 Ω

Digitizing depth: up to 50,000 samples (16,000 samples max. per elementary channel)

hardware / firmware configuration
Parallel summations for fast data acquisition / beam forming

Parallel architecture: 32-, 64-, 128-, and 256-channel systems are available

FPGA on CPU-board

Windows-based PC, USB2 link between Hardware and PC (desktop or laptop)

software
CIVA subset into Multi2000 software, complete description of the inspection configuration Focal-laws and associated ultrasonic field computation
Compatibility with CIVA, NDT kit / ULTIS
I-O
32: 1 Hypertronix connector      64,128: 2 Hypertronix connectors       256: 4 Hypertronix
8 encoders input, 31 analog input + 1 synchro output

2 switch, 4 TTL inputs, 4 TTL outputs

8 analog outputs, 2 open collector, 1 I/O  synchro,1 USB2

16 analog inputs, 4 LEMO connectors (type 00) (up to 8 optional)

General
32, 64, 128: L x W x H: 236 mm x 376 mm x 266 mm

Weight: ~9.5 kg

256: L x W x H:  342 mm x 376 mm x 266 mm

Weight: ~13 kg

 Indicated values may change without notice.